DOI
10.1109/TEECCON59234.2023.10335835
Link
https://ieeexplore.ieee.org/document/10335835
Year of Publication
2023
Type
Conference Proceedings
Published in
Second International Conference on Trends in Electrical, Electronics & Computer Engineering : Submission
Publication Title
Dual Source Vertical TFET Channel Overlapped Structure with Enhanced RF/Analog Performance for Low-Power- Applications, 23-24th August, (TEECCON) REVA University, Bengaluru, India
Status
International
First Author
Archana
Second Author
Sheetal Singh
Third Author
Subodh Wairya
Page Numbers
198-203
Status of Paper
Published
Related Department
Electronics & Communication Engineering Department
Nature
SCOPUS
Publisher
IEEE
Refereed/Peer Reviewed
Peer Reviewed
Month of Publication
Dec